doc. no : qw0905- rev. : date : data sheet round type led lamps lg2640/s81-pf ligitek electronics co.,ltd. property of ligitek only lg2640/s81-pf 22 - oct. - 2008 a pb lead-free parts
directivity radiation note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. package dimensions ligitek electronics co.,ltd. property of ligitek only part no. lg2640/s81-pf page 1/5 30 0 60 50%75% 25%0 25% 100% -30 -60 50% 75% 100% 16.5min 3.1 2.9 0.5 typ 2.54typ 1.0min 1.5max 4.3 3.3 + -
note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. absolute maximum ratings at ta=25 i fp pd i f tstg t opr symbol typical electrical & optical characteristics (ta=25 ) power dissipation reverse current @5v storage temperature operating temperature parameter peak forward current duty 1/10@10khz forward current part no. lg2640/s81-pf 100 -40 ~ +100 -40 ~ +85 ir10 ratings g 120 30 mw a ma ma unit ligitek electronics co.,ltd. property of ligitek only page2/5 50 viewing angle 2 1/2 (deg) min. 12 20 min. 1.7 forward voltage @ ma(v) max. 2.6 peak wave length pnm 565 spectral halfwidth nm 30 typ. luminous intensity @10ma(mcd) 20 emitted green part no lg2640/s81-pf material gap lens color green diffused
ligitek electronics co.,ltd. property of ligitek only fig.2 relative intensity vs. forward current 1000 100 10 forward current(ma) 1.0 5.0 4.0 3.0 2.0 forward voltage(v) r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a g chip 1000 10 1.0 1.0 0.1 f o r w a r d c u r r e n t ( m a ) 100 typical electro-optical characteristics curve fig.1 forward current vs. forward voltage 3.0 2.0 1.0 1.5 2.5 fig.4 relative intensity vs. temperature 100 40 20 06080 0.0 100-40 020406080 ambient temperature( ) -20 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 0.5 1.2 1.1 0.9 1.0 0.8 -40-20 1.0 f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) wavelength (nm) 0.5 0.0 r e l a t i v e i n t e n s i t y @ 2 0 m a part no. lg2640/s81-pf page 3/5 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 650 600 550 500
dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) note: 1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 0 60 seconds max 0 preheat 50 25 120 2 /sec max time(sec) 100 150 temp( c) 260 5 /sec max 260 c3sec max page 4/5 soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) 2.wave soldering profile ligitek electronics co.,ltd. property of ligitek only part no. lg2640/s81-pf
this test intended to see soldering well performed or not. the purpose of this test is the resistance of the device under tropical for hous. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. solderability test 1.t.sol=230 5 2.dwell time=5 1sec high temperature high humidity test thermal shock test solder resistance test the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202:103b jis c 7021: b-11 this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. operating life test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) high temperature storage test low temperature storage test the purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) reliability test: test item test condition description mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 reference standard ligitek electronics co.,ltd. property of ligitek only 5/5 page part no. lg2640/s81-pf
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